Invention Grant
US07883993B2 Semiconductor device with semiconductor chip and rewiring layer and method for producing the same
有权
具有半导体芯片和重新布线层的半导体器件及其制造方法
- Patent Title: Semiconductor device with semiconductor chip and rewiring layer and method for producing the same
- Patent Title (中): 具有半导体芯片和重新布线层的半导体器件及其制造方法
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Application No.: US11476046Application Date: 2006-06-28
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Publication No.: US07883993B2Publication Date: 2011-02-08
- Inventor: Edward Fuergut , Hermann Vilsmeier , Holger Woerner
- Applicant: Edward Fuergut , Hermann Vilsmeier , Holger Woerner
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Edell, Shapiro & Finnan, LLC
- Priority: DE10352946 20031111
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/14
Abstract:
The invention relates to a semiconductor device with a semiconductor chip and a rewiring layer, the semiconductor chip being embedded in a housing plastics composition by its rear side contact. The active top side of the semiconductor chip forms a coplanar overall top side with the top side of the housing plastics composition. The rear side contact is led to the overall top side via a flat conductor sheet tape, so that the rear side contact of the semiconductor chip can be accessed from the overall top side.
Public/Granted literature
- US20060246624A1 Semiconductor device with semiconductor chip and rewiring layer and method for producing the same Public/Granted day:2006-11-02
Information query
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