Invention Grant
- Patent Title: Nanostructured dielectric composite materials
- Patent Title (中): 纳米结构介电复合材料
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Application No.: US12505037Application Date: 2009-07-17
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Publication No.: US07884149B2Publication Date: 2011-02-08
- Inventor: John Keith Nelson , Walter Zenger , Robert John Keefe , Linda Sue Schadler Feist
- Applicant: John Keith Nelson , Walter Zenger , Robert John Keefe , Linda Sue Schadler Feist
- Applicant Address: US NY Troy
- Assignee: Rensselaer Polytechnic Institute, Inc.
- Current Assignee: Rensselaer Polytechnic Institute, Inc.
- Current Assignee Address: US NY Troy
- Agency: Curatolo Sidoti Co., LPA
- Agent Jospeh G. Curatolo; Peter R. Detorre
- Main IPC: C08K3/22
- IPC: C08K3/22 ; C08K9/06 ; H01B3/44

Abstract:
A nanocomposite material suitable for electrical insulation includes a polymer compounded with a substantially homogeneously distributed functionalized nanoparticle filler. The nanocomposite material is produced by compounding the polymer with the functionalized nanoparticle filler by imparting a shear force to a mixture of the polymer and filler capable of preventing agglomeration of the filler whereby the filler is substantially homogeneously distributed in the nanocomposite material. The electrical insulation may be adapted for AC or DC high voltage, and may also be adapted for low or medium voltage to prevent formation of water tree structures.
Public/Granted literature
- US20100036035A1 Nanostructured Dielectric Composite Materials Public/Granted day:2010-02-11
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