Invention Grant
- Patent Title: Rubber composition
- Patent Title (中): 橡胶组成
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Application No.: US10596755Application Date: 2005-12-20
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Publication No.: US07884154B2Publication Date: 2011-02-08
- Inventor: Naomi Okamoto , Mitsuharu Anbe
- Applicant: Naomi Okamoto , Mitsuharu Anbe
- Applicant Address: JP Yamaguchi
- Assignee: UBE Industries, Ltd.
- Current Assignee: UBE Industries, Ltd.
- Current Assignee Address: JP Yamaguchi
- Agency: Panitch Schwarze Belisario & Nadel LLP
- Priority: JP2004-369597 20041221; JP2004-369643 20041221; JP2004-369685 20041221; JP2004-369707 20041221; JP2004-369733 20041221; JP2004-369771 20041221; JP2004-369782 20041221
- International Application: PCT/JP2005/023379 WO 20051220
- International Announcement: WO2006/052035 WO 20060518
- Main IPC: C08K3/34
- IPC: C08K3/34 ; B60C1/00

Abstract:
The rubber composition of the invention includes a rubber composition which is a silica compounded rubber composition for tire containing 100 parts by weight of a rubber component made of (a) from 20 to 80% by weight of a vinyl-cis-polybutadiene rubber containing 1,2-polybutadiene having a melting point of 170° C. or higher and a high-molecular substance having at least one unsaturated double bond per a repeating unit and comprising at least one member selected from polyisoprene, crystalline polybutadiene having a melting point of not higher than 150° C., liquid polybutadiene and derivatives thereof and (b) from 80 to 20% by weight of a diene-based rubber other than (a); and (c) from 40 to 100 parts by weight of a rubber reinforcing agent containing 40% or more of silica, wherein the 1,2-polybutadiene is dispersed in a short crystalline fiber state and the high-molecular substance is dispersed in a granular state in the cis-polybutadiene rubber which is a matrix component of the subject vinyl-cis-polybutadiene rubber (a); and the short crystalline fiber of the 1,2-polybutadiene is dispersed in particles of the high-molecular substance.
Public/Granted literature
- US20070155889A1 Rubber composition Public/Granted day:2007-07-05
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