Invention Grant
US07884387B2 Epitaxial wafer for semiconductor light emitting diode and semiconductor light emitting diode using same
有权
用于半导体发光二极管的外延晶片和使用其的半导体发光二极管
- Patent Title: Epitaxial wafer for semiconductor light emitting diode and semiconductor light emitting diode using same
- Patent Title (中): 用于半导体发光二极管的外延晶片和使用其的半导体发光二极管
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Application No.: US12134271Application Date: 2008-06-06
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Publication No.: US07884387B2Publication Date: 2011-02-08
- Inventor: Takashi Takeuchi , Toshimitsu Sukegawa
- Applicant: Takashi Takeuchi , Toshimitsu Sukegawa
- Applicant Address: JP Tokyo
- Assignee: Hitachi Cable, Ltd.
- Current Assignee: Hitachi Cable, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2007-309650 20071130
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
An epitaxial wafer for a semiconductor light emitting device according to the present invention in which at least an n-type cladding layer formed with a mixed crystal made of an AlGaInP material, an active layer, a p-type Mg-doped cladding layer, and a p-type contact layer are stacked successively in that order on an n-type GaAs substrate, and the p-type contact layer is formed as at least two layers that are an Mg-doped contact layer and a Zn-doped contact layer stacked thereon when viewed from the n-type GaAs substrate, comprises a Zn-doped layer which is inserted between the p-type Mg-doped cladding layer and the p-type contact layer.
Public/Granted literature
- US20090140273A1 Epitaxial Wafer for Semiconductor Light Emitting Diode and Semiconductor Light Emitting Diode Using Same Public/Granted day:2009-06-04
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