Invention Grant
- Patent Title: Light emitting diode having a first GaN layer and a first semiconductor layer each having a predetermined thickness and fabrication method therof
- Patent Title (中): 具有第一GaN层和各自具有预定厚度的第一半导体层的发光二极管和制造方法
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Application No.: US12624404Application Date: 2009-11-23
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Publication No.: US07884388B2Publication Date: 2011-02-08
- Inventor: Seong Jae Kim
- Applicant: Seong Jae Kim
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd
- Current Assignee: LG Innotek Co., Ltd
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR2003-48993 20030718
- Main IPC: H01L29/24
- IPC: H01L29/24 ; H01L33/00 ; H01L29/06 ; H01L31/0328 ; H01L31/0336 ; H01L31/072 ; H01L31/109 ; H01L27/15 ; H01L29/26 ; H01L29/12 ; H01L29/22 ; H01L29/221

Abstract:
A light emitting diode (LED) and a method for fabricating the same, capable of improving brightness by forming a InGaN layer having a low concentration of indium, and whose lattice constant is similar to that of an active layer of the LED, is provided. The LED includes: a buffer layer disposed on a sapphire substrate; a GaN layer disposed on the buffer layer; a doped GaN layer disposed on the GaN layer; a GaN layer having indium disposed on the GaN layer; an active layer disposed on the GaN layer having indium; and a P-type GaN disposed on the active layer. Here, an empirical formula of the GaN layer having indium is given by In(x)Ga(1−x)N and a range of x is given by 0
Public/Granted literature
- US20100065816A1 LIGHT EMITTING DIODE AND FABRICATION METHOD THEREOF Public/Granted day:2010-03-18
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