Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12002096Application Date: 2007-12-14
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Publication No.: US07884419B2Publication Date: 2011-02-08
- Inventor: Byung Tak Jang
- Applicant: Byung Tak Jang
- Applicant Address: KR Seoul
- Assignee: Dongbu HiTek Co., Ltd.
- Current Assignee: Dongbu HiTek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: The Law Offices of Andrew D. Fortney
- Agent Andrew D. Fortney
- Priority: KR10-2006-0135702 20061227
- Main IPC: H01L29/76
- IPC: H01L29/76

Abstract:
Provided are a semiconductor device and a method of fabricating the semiconductor device. The semiconductor device includes a first conductive well region in a semiconductor substrate and a second conductive well region on or in the first conductive well region. A gate electrode is in a trench on a gate insulation layer, and the trench is in the second conductive region and the first conductive well region. A drain includes a drain insulation layer, a (polysilicon) shield layer, and drain plug. The drain insulation layer is in a trench in the second conductive region and the first conductive well region. The shield layer encloses the drain plug. A lower portion of the drain plug contacts the second conductive well region. A first conductive source region is at a side of the gate electrode.
Public/Granted literature
- US20090095999A1 Semiconductor device and method of fabricating the same Public/Granted day:2009-04-16
Information query
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