Systems and methods are provided for shielding integrated circuits from electromagnetic or electrostatic fields by locating an active device layer between two conductors that are electrically coupled together. In certain embodiments, a sensor comprises a conductive substrate that provides structural support and shielding to circuit elements in a semiconductor device layer. The device layer is between the conductive substrate and a shield layer that are electrically coupled together to create a shield or “Faraday box.” In certain embodiments, the device layer is substantially isolated from the conductive substrate and the shield layer by insulative layers. In certain embodiments, an input voltage powers the device layer and is also coupled to the substrate and the shield layer. Thus, the conductive substrate and the shield layer absorb and/or repel electrostatic charges or ions in a medium surrounding the sensor.