Invention Grant
- Patent Title: Semiconductor integrated circuit
- Patent Title (中): 半导体集成电路
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Application No.: US11785673Application Date: 2007-04-19
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Publication No.: US07884440B2Publication Date: 2011-02-08
- Inventor: Yi-Sun Chung
- Applicant: Yi-Sun Chung
- Applicant Address: KR Chungcheongbuk-Do
- Assignee: MagnaChip Semiconductor, Ltd.
- Current Assignee: MagnaChip Semiconductor, Ltd.
- Current Assignee Address: KR Chungcheongbuk-Do
- Agency: Morgan Lewis & Bockius LLP
- Priority: KR10-2006-0037865 20060426; KR10-2007-0026209 20070316
- Main IPC: H01L21/70
- IPC: H01L21/70

Abstract:
A semiconductor integrated circuit including digital circuits and analog circuits integrated over a single substrate includes the substrate including portions where the digital circuits and the analog circuits are to be formed, and a plurality of deep-wells formed to a certain thickness inside the substrate to surround portions where devices of the digital circuits and devices of the analog circuits are to be formed to reduce interference between the devices of the analog circuits and the digital circuits.
Public/Granted literature
- US20070252731A1 Semiconductor integrated circuit Public/Granted day:2007-11-01
Information query
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