Invention Grant
US07884456B2 Semiconductor device has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant
有权
半导体器件具有倒角的密封剂，使得衬底和倒角的部分从密封剂暴露，并且衬底表面的剩余部分被密封剂覆盖
- Patent Title: Semiconductor device has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant
- Patent Title (中): 半导体器件具有倒角的密封剂，使得衬底和倒角的部分从密封剂暴露，并且衬底表面的剩余部分被密封剂覆盖
-
Application No.: US12233170Application Date: 2008-09-18
-
Publication No.: US07884456B2Publication Date: 2011-02-08
- Inventor: Yun-Lung Tsai , Yu-Chieh Tsai , Chien-Chih Chen , Chien-Ping Huang
- Applicant: Yun-Lung Tsai , Yu-Chieh Tsai , Chien-Chih Chen , Chien-Ping Huang
- Applicant Address: TW Taichung
- Assignee: Silicon Precision Industries Co., Ltd.
- Current Assignee: Silicon Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Priority: TW94118702A 20050607
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A semiconductor device and a fabrication method thereof are provided. An opening having at least one slanted side is formed on a substrate. At least one chip and at least one passive component are mounted on the substrate. An encapsulant having a cutaway corner is formed on the substrate to encapsulate the chip and the passive component, wherein the cutaway corner of the encapsulant is spaced apart from the slanted side of the opening by a predetermined distance. A singulation process is performed to cut the encapsulant to form a package with a chamfer. The package is embedded in a lid to form the semiconductor device, wherein a portion of the substrate located between the slanted side of the opening and the cutaway corner of the encapsulant is exposed from the encapsulant to form an exposed portion. The present invention also provides a carrier for the semiconductor device.
Public/Granted literature
Information query
IPC分类:
