Invention Grant
- Patent Title: Integrated circuit packaging system with carrier and method of manufacture thereof
- Patent Title (中): 具有载体的集成电路封装系统及其制造方法
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Application No.: US12360644Application Date: 2009-01-27
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Publication No.: US07884460B2Publication Date: 2011-02-08
- Inventor: Choong Bin Yim , Hyeog Chan Kwon , Jong-Woo Ha
- Applicant: Choong Bin Yim , Hyeog Chan Kwon , Jong-Woo Ha
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A method of manufacture of an integrated circuit packaging system includes: forming a carrier having a top side and a bottom side; forming an edge terminal pad on the top side and an inner terminal pad on the bottom side; connecting an integrated circuit die to an inner portion of the edge terminal pad; and encapsulating the integrated circuit die and the inner portion of the edge terminal pad with the outer portion of the edge terminal pad exposed.
Public/Granted literature
- US20090134509A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CARRIER AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2009-05-28
Information query
IPC分类:
