Invention Grant
- Patent Title: Semiconductor apparatus
- Patent Title (中): 半导体装置
-
Application No.: US11710486Application Date: 2007-02-26
-
Publication No.: US07884478B2Publication Date: 2011-02-08
- Inventor: Shoji Azuma
- Applicant: Shoji Azuma
- Applicant Address: JP Tokyo
- Assignee: Elpida Memory, Inc.
- Current Assignee: Elpida Memory, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Young & Thompson
- Priority: JP2006-049625 20060227
- Main IPC: H01L23/52
- IPC: H01L23/52
Abstract:
In a semiconductor apparatus having a plurality of wiring layers, the semiconductor apparatus includes a bonding pad formed by an uppermost wiring layer, a first-layer plug wire formed by a first lower wiring layer in a region under the bonding pad, and a first conductive plug connecting the bonding pad and the first-layer plug wire. The first-layer plug wire may include a plurality of first-layer plug wires arranged in parallel to one another in a stripe pattern.
Public/Granted literature
- US20070200242A1 Semiconductor apparatus Public/Granted day:2007-08-30
Information query
IPC分类:
