Systems and methods are disclosed for forming interconnects between semiconductor devices in accordance with one or more embodiments of the present invention. For example, a method of forming interconnects between semiconductor devices includes depositing a plurality of first contacts on a plurality of corresponding first pads of a first semiconductor device; forming a plurality of plated contacts on a plurality of corresponding second pads of a second semiconductor device; aligning the plurality of first contacts with the plurality of plated contacts; and joining the plurality of first contacts to the plurality of plated contacts to form the interconnects between the first semiconductor device and the second semiconductor device.