Invention Grant
- Patent Title: Semiconductor inspecting device
- Patent Title (中): 半导体检测装置
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Application No.: US12370072Application Date: 2009-02-12
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Publication No.: US07884632B2Publication Date: 2011-02-08
- Inventor: Akinori Shiraishi , Mitsutoshi Higashi , Kei Murayama , Katsunori Yamagishi , Mitsuhiro Aizawa
- Applicant: Akinori Shiraishi , Mitsutoshi Higashi , Kei Murayama , Katsunori Yamagishi , Mitsuhiro Aizawa
- Applicant Address: JP Nagano-shi, Nagano
- Assignee: Shinko Electric Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano-shi, Nagano
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2008-031896 20080213
- Main IPC: G01R31/02
- IPC: G01R31/02 ; G01R31/26
Abstract:
In a semiconductor inspecting device having a contact to be electrically connected to an electrode pad formed in a semiconductor device which is an object to be measured, and a substrate provided with the contact, the contact is provided obliquely to a main surface of the substrate.
Public/Granted literature
- US20090206861A1 SEMICONDUCTOR INSPECTING DEVICE Public/Granted day:2009-08-20
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