Invention Grant
- Patent Title: MEMS fabrication on a laminated substrate
- Patent Title (中): 层压基板上的MEMS制造
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Application No.: US11428446Application Date: 2006-07-03
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Publication No.: US07884689B2Publication Date: 2011-02-08
- Inventor: Bedri A. Cetiner , Mark Bachman , Guann-Pyng Li , Jiangyuan Qian , Hung-Pin Chang , Franco De Flaviis
- Applicant: Bedri A. Cetiner , Mark Bachman , Guann-Pyng Li , Jiangyuan Qian , Hung-Pin Chang , Franco De Flaviis
- Applicant Address: US CA Oakland
- Assignee: The Regents of the University of California
- Current Assignee: The Regents of the University of California
- Current Assignee Address: US CA Oakland
- Agency: Orrick, Herrington & Sutcliffe, LLP
- Main IPC: H01H51/22
- IPC: H01H51/22

Abstract:
Systems and methods are provided that facilitate the formation of micro-mechanical structures and related systems on a laminated substrate. More particularly, a micro-mechanical device and a three-dimensional multiple frequency antenna are provided for in which the micro-mechanical device and antenna, as well as additional components, can be fabricated together concurrently on the same laminated substrate. The fabrication process includes a low temperature disposition process allowing for deposition of an insulator material at a temperature below the maximum operating temperature of the laminated substrate, as well as a planarization process allowing for the molding and planarizing of a polymer layer to be used as a form for a micro-mechanical device.
Public/Granted literature
- US20060238951A1 MEMS Fabrication on a Laminated substrate Public/Granted day:2006-10-26
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