Invention Grant
US07884695B2 Low resistance inductors, methods of assembling same, and systems containing same
有权
低阻抗电感器，其组装方法以及含有它们的系统
- Patent Title: Low resistance inductors, methods of assembling same, and systems containing same
- Patent Title (中): 低阻抗电感器，其组装方法以及含有它们的系统
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Application No.: US11428307Application Date: 2006-06-30
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Publication No.: US07884695B2Publication Date: 2011-02-08
- Inventor: Larry E. Mosley , Clive R. Hendricks
- Applicant: Larry E. Mosley , Clive R. Hendricks
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agent John N. Greaves
- Main IPC: H01F5/00
- IPC: H01F5/00
Abstract:
A low-resistance inductor is made from a plurality of first inter-abutting insulated electrode coil sub-segments that is coupled to a plurality of second intra-abutting insulated electrode coil sub-segments that are contiguous to the plurality of first intra-abutting coil sub-segments. The first plurality and the second plurality form an helical inductor unit cell. A process of forming the low-resistance inductor includes heat curing. A system includes a low-resistance inductor and a mounting substrate.
Public/Granted literature
- US20080048813A1 LOW RESISTANCE INDUCTORS, METHODS OF ASSEMBLING SAME, AND SYSTEMS CONTAINING SAME Public/Granted day:2008-02-28
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