A device manufacturing method includes transferring a pattern from a patterning device onto a substrate. The method includes bringing the patterning device and the support together, and applying a substantially stationary force between the patterning device and the support to hold the patterning device. The patterning device is now excited by a substantially dynamic force to enable a micro slipping thereof. Then, the patterning device is aligned, and the pattern is transferred from the patterning device onto the substrate. The patterning device may be excited with an alternating acceleration. When the patterning device is excited, the patterning device is allowed to settle with respect to the support, thereby improving a friction therebetween to reduce a risk of slipping or local slipping of the patterning device.