Invention Grant
- Patent Title: Residual stress measuring method and system
- Patent Title (中): 残余应力测量方法和系统
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Application No.: US11935673Application Date: 2007-11-06
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Publication No.: US07884924B2Publication Date: 2011-02-08
- Inventor: Shohei Numata , Atsushi Baba , Tetsuya Matsui
- Applicant: Shohei Numata , Atsushi Baba , Tetsuya Matsui
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Brundidge & Stanger, P.C.
- Priority: JP2006-321877 20061129
- Main IPC: G01L1/24
- IPC: G01L1/24

Abstract:
A residual stress measuring method capable of measuring residual stress of the surface of an object to be inspected rapidly in a non-destructive non-contact manner, as well as a residual stress measuring system having such characteristics and being high in portability, are provided. The residual stress measuring system comprises a heating laser for heating an inspection area of an object to be inspected, a laser interferometer for irradiating the inspection area interferometric with laser light and measuring a deformation quantity within an elastic deformation range upon stress relief by heating in accordance with a laser interferometric method, and a data processor for measuring residual stress from the deformation quantity within the elastic deformation range upon stress relief of the object to be inspected.
Public/Granted literature
- US20080123079A1 RESIDUAL STRESS MEASURING METHOD AND SYSTEM Public/Granted day:2008-05-29
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