Invention Grant
- Patent Title: Cover assembly
- Patent Title (中): 盖组件
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Application No.: US12391355Application Date: 2009-02-24
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Publication No.: US07885058B2Publication Date: 2011-02-08
- Inventor: Chang-Zhi Li , Qi-Xiang Wen
- Applicant: Chang-Zhi Li , Qi-Xiang Wen
- Applicant Address: CN ShenZhen, Guangdong Province HK Kowloon
- Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee Address: CN ShenZhen, Guangdong Province HK Kowloon
- Agent Steven M. Reiss
- Priority: CN200810305794 20081127
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/00 ; H04M1/00
Abstract:
A cover assembly used in a portable electronic device is described. The cover assembly includes a body member defining an earphone hole and a cover member defining a through hole. The cover member is rotatably mounted to the body member to cover or expose the earphone hole.
Public/Granted literature
- US20100128420A1 COVER ASSEMBLY Public/Granted day:2010-05-27
Information query
