Invention Grant
- Patent Title: Computer chassis with partitions for improved airflow
- Patent Title (中): 带有隔板的电脑机箱,以改善气流
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Application No.: US11299056Application Date: 2005-12-09
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Publication No.: US07885062B2Publication Date: 2011-02-08
- Inventor: Barry A. Wagner , Don Le , William P. Tsu
- Applicant: Barry A. Wagner , Don Le , William P. Tsu
- Applicant Address: US CA Santa Clara
- Assignee: NVIDIA Corporation
- Current Assignee: NVIDIA Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H05K5/00
- IPC: H05K5/00

Abstract:
The present invention pertains to a computer chassis with improved airflow to reduce the occurrence of trapped air pockets and increase heat transfer from components within the chassis. The computer chassis includes a plurality of chambers, wherein each of the chambers is separated by a partition. The partitions are operable to reduce the occurrence of trapped air pockets and increase heat transfer from components of the chassis by causing air to flow through each of the chambers. The computer chassis further includes at least two air vents, wherein each of the chambers is coupled to at least one of the at least two air vents through which air enters the chamber, and wherein each of the chambers is coupled to at least one of the at least two air vents through which air exits the chamber.
Public/Granted literature
- US20070133167A1 Computer chassis for improved airflow and heat transfer from computer system components Public/Granted day:2007-06-14
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