Invention Grant
- Patent Title: Multi-chip package
- Patent Title (中): 多芯片封装
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Application No.: US12102701Application Date: 2008-04-14
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Publication No.: US07885139B2Publication Date: 2011-02-08
- Inventor: Je Il Ryu , You Sung Kim
- Applicant: Je Il Ryu , You Sung Kim
- Applicant Address: KR Icheon-si
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Icheon-si
- Agency: Townsend and Townsend and Crew LLP
- Priority: KR10-2007-0123329 20071130
- Main IPC: G11C8/00
- IPC: G11C8/00
Abstract:
A multi-chip package includes a plurality of memory chips and a control chip, wherein the control chip stores information about whether the memory chips are operating normally and selects chips that are operating normally according to an address signal.
Public/Granted literature
- US20090231897A1 MULTI-CHIP PACKAGE Public/Granted day:2009-09-17
Information query
