Invention Grant
- Patent Title: Optical signaling for a package-on-package stack
- Patent Title (中): 封装封装堆栈的光信号
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Application No.: US12166680Application Date: 2008-07-02
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Publication No.: US07885494B2Publication Date: 2011-02-08
- Inventor: Nils Magnus Lundberg
- Applicant: Nils Magnus Lundberg
- Applicant Address: SE Lund
- Assignee: Sony Ericsson Mobile Communications AB
- Current Assignee: Sony Ericsson Mobile Communications AB
- Current Assignee Address: SE Lund
- Agency: Harrity & Harrity, LLP
- Main IPC: G02B6/26
- IPC: G02B6/26

Abstract:
A package-on-package stack may include an upper package, an optical interface, and a lower package. The upper package may send an optical signal from a first component in the upper package. The optical interface may receive the optical signal from the upper package, and may transmit the optical signal. The lower package may receive the optical signal from the optical interface, and may relay the optical signal to a second component in the lower package or at the motherboard.
Public/Granted literature
- US20100002990A1 OPTICAL SIGNALING FOR A PACKAGE-ON-PACKAGE STACK Public/Granted day:2010-01-07
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