Invention Grant
US07885723B2 Setting device, component mounting system, program and calculating method
失效
设定装置，部件安装系统，程序和计算方法
- Patent Title: Setting device, component mounting system, program and calculating method
- Patent Title (中): 设定装置，部件安装系统，程序和计算方法
-
Application No.: US11773836Application Date: 2007-07-05
-
Publication No.: US07885723B2Publication Date: 2011-02-08
- Inventor: Takafumi Chida , Attila Lengyel , Ken Igarashi , Haruhiko Yamaguchi , Manabu Okamoto , Koichi Izuhara
- Applicant: Takafumi Chida , Attila Lengyel , Ken Igarashi , Haruhiko Yamaguchi , Manabu Okamoto , Koichi Izuhara
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Tech Instruments Co., Ltd.
- Current Assignee: Hitachi High-Tech Instruments Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Mattingly & Malur, P.C.
- Priority: JP2006-187533 20060707
- Main IPC: G06F19/00
- IPC: G06F19/00 ; G05B13/02 ; H05K3/30
Abstract:
Technology is provided for changing a mounting angle of a component to reduce the amount of relative displacement between a mounting head and a board. A component, for which a mounting angle can be changed, is specified based on information stored in a mounting data storage area and a component data storage area according to a predetermined component mounting order. A mounting time in a mounting path with the mounting angle of the specified component being changed is calculated for each mounting angle to specify the mounting path requiring the shortest mounting time.
Public/Granted literature
- US20080005892A1 SETTING DEVICE, COMPONENT MOUNTING SYSTEM, PROGRAM AND CALCULATING METHOD Public/Granted day:2008-01-10
Information query
