Invention Grant
- Patent Title: Flattening hierarchically structured flows
- Patent Title (中): 扁平化分层结构化流
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Application No.: US12325416Application Date: 2008-12-01
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Publication No.: US07886280B2Publication Date: 2011-02-08
- Inventor: Hamzeh Zawawy
- Applicant: Hamzeh Zawawy
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Greg Goshorn, P.C.
- Agent Matthew W. Baca; Gregory K Goshorn
- Main IPC: G06F9/44
- IPC: G06F9/44

Abstract:
There is disclosed a system for flattening hierarchically structured flows using a breadth-first approach. At each level of hierarchy of a hierarchically structured source flow, complex nodes are flattened by one level across the entire breadth of the flow. The results of this flattening are placed in a target flow, and any connections that existed in the source flow are re-established in the target flow in such a way that any data input into the target flow will be processed as if it had been input into the source flow. After a processing iteration, if there are still complex nodes remaining in the target flow, the target flow becomes the next source flow, and the process is repeated until the flow has been completely flattened.
Public/Granted literature
- US20090083723A1 Flattening Hierarchically Structured Flows Public/Granted day:2009-03-26
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