Invention Grant
- Patent Title: Stent crimping apparatus and method
- Patent Title (中): 支架压接装置及方法
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Application No.: US11489309Application Date: 2006-07-18
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Publication No.: US07886419B2Publication Date: 2011-02-15
- Inventor: Bin Huang , David C. Gale , Daniel Castro
- Applicant: Bin Huang , David C. Gale , Daniel Castro
- Applicant Address: US CA Santa Clara
- Assignee: Advanced Cardiovascular Systems, Inc.
- Current Assignee: Advanced Cardiovascular Systems, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Suire, Sanders & Dempsey LLP.
- Main IPC: G01M19/00
- IPC: G01M19/00 ; B23Q3/00
Abstract:
A method for crimping a stent onto a balloon includes inflating a balloon with a fluid, sliding a stent over the inflated balloon, crimping the stent onto the balloon, and controlling the pressure inside the balloon below a given value when the stent is being crimped onto the balloon.
Public/Granted literature
- US20080016668A1 Stent crimping apparatus and method Public/Granted day:2008-01-24
Information query
