Invention Grant
- Patent Title: Ground stud installation on composite structures for electrostatic charges
- Patent Title (中): 静电荷复合结构上的地脚螺栓安装
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Application No.: US11834141Application Date: 2007-08-06
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Publication No.: US07886439B2Publication Date: 2011-02-15
- Inventor: Stephen M. Braden , John R. Porter , Nick I. Tavernarakis
- Applicant: Stephen M. Braden , John R. Porter , Nick I. Tavernarakis
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Yee & Associates, P.C.
- Agent Dennis R. Plank
- Main IPC: H01R43/00
- IPC: H01R43/00

Abstract:
Apparatus for bleeding electrical charge and methods for installing a ground stud in a composite structure. The apparatus includes a ground stud and a composite structure including a hole. In one embodiment the ground stud engages the hole in the composite structure in a transition fit. In another embodiment the ground stud is countersunk within the composite structure. Embodiments of the present methods include drilling a hole in the composite structure; inserting the ground stud into the hole such that the ground stud is in electrical contact with conductive fibers within the composite structure; securing the ground stud to the composite structure; and attaching a connective device to the ground stud such that the connective device is in electrical contact with the ground stud. In some embodiments the ground stud and the composite structure engage one another in a transition fit. In some embodiments the ground stud includes a pin, and a portion of the pin that contacts the composite structure is non-threaded. In some embodiments the ground stud is countersunk within the composite structure.
Public/Granted literature
- US20070270002A1 GROUND STUD INSTALLATION ON COMPOSITE STRUCTURES FOR ELECTROSTATIC CHARGES Public/Granted day:2007-11-22
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