Invention Grant
US07886575B2 High sensitivity acoustic wave microsensors based on stress effects
失效
基于应力影响的高灵敏度声波微传感器
- Patent Title: High sensitivity acoustic wave microsensors based on stress effects
- Patent Title (中): 基于应力影响的高灵敏度声波微传感器
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Application No.: US11875162Application Date: 2007-10-19
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Publication No.: US07886575B2Publication Date: 2011-02-15
- Inventor: Reichl B Haskell , Daniel S Stevens , Jeffrey C Andle
- Applicant: Reichl B Haskell , Daniel S Stevens , Jeffrey C Andle
- Applicant Address: US DE Wilmington
- Assignee: Delaware Capital Formation, Inc.
- Current Assignee: Delaware Capital Formation, Inc.
- Current Assignee Address: US DE Wilmington
- Agency: Vern Maine & Associates
- Main IPC: G01N29/02
- IPC: G01N29/02

Abstract:
Acoustic sensing utilizing a bridge structure coupled about a portion of at least two sides of said bridge to a base substrate, wherein said bridge includes a piezoelectric section and has at least one active acoustic region proximate said bridge. A sensing material is disposed on at least a portion of at least one surface of the bridge, wherein the bridge produces stress effects measurable by an acoustic wave device located in the active acoustic region. According to one embodiment, the stress effects are measured by an acoustic wave device to sense a target matter. As target molecules accumulate on a sensing film affixed to at least a portion of the bridge, stress is produced in the bridge inducing a frequency change measured by an acoustic wave device.
Public/Granted literature
- US20080163694A1 HIGH SENSITIVITY ACOUSTIC WAVE MICROSENSORS BASED ON STRESS EFFECTS Public/Granted day:2008-07-10
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