Invention Grant
- Patent Title: Intelligent cooling method combining passive and active cooling components
- Patent Title (中): 智能冷却方式结合被动和主动冷却组件
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Application No.: US11502696Application Date: 2006-08-11
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Publication No.: US07886816B2Publication Date: 2011-02-15
- Inventor: Chien Ouyang
- Applicant: Chien Ouyang
- Applicant Address: US CA Redwood City
- Assignee: Oracle America, Inc.
- Current Assignee: Oracle America, Inc.
- Current Assignee Address: US CA Redwood City
- Agency: Osha Liang LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F27/00 ; F28D15/00
Abstract:
A method for cooling a semiconductor including passive cooling including transferring heat via passive cooling components; active cooling including transferring heat via active cooling components; and controlling the active cooling based on temperature of the semiconductor. A cooling system for a semiconductor including: a passive component in thermal contact with the semiconductor; an active cooling component in thermal contact with the semiconductor; and a controller controlling the active cooling component.
Public/Granted literature
- US20080036076A1 Intelligent cooling method combining passive and active cooling components Public/Granted day:2008-02-14
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