Invention Grant
- Patent Title: Front opening wafer carrier with path to ground effectuated by door
- Patent Title (中): 前开口晶片载体具有通过门的路径
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Application No.: US10496756Application Date: 2002-11-26
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Publication No.: US07886910B2Publication Date: 2011-02-15
- Inventor: Gregory Bores , Suraj Kalia , Anthony Mathius Tieben
- Applicant: Gregory Bores , Suraj Kalia , Anthony Mathius Tieben
- Applicant Address: US MA Billerica
- Assignee: Entegris, Inc.
- Current Assignee: Entegris, Inc.
- Current Assignee Address: US MA Billerica
- Agency: Patterson Thuente Christensen Pedersen P.A.
- International Application: PCT/US02/37926 WO 20021126
- International Announcement: WO03/045820 WO 20030605
- Main IPC: B65D85/00
- IPC: B65D85/00
Abstract:
A front opening wafer carrier formed principally of plastic and comprising an enclosure portion (20) and a door (24) has a path to ground with respect to the wafers (22), the path to ground effectuated by the door (24). The base “ground” may be provided at the machine interface upon which the carrier sits, or through the robotic arm that grasps, operates and moves the door (24).
Public/Granted literature
- US20050224391A1 Front opening wafer carrier with path to ground effectuated by door Public/Granted day:2005-10-13
Information query
IPC分类:
