Invention Grant
- Patent Title: Hot melt application system
- Patent Title (中): 热熔胶应用系统
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Application No.: US12831752Application Date: 2010-07-07
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Publication No.: US07886935B2Publication Date: 2011-02-15
- Inventor: Bernard Lasko
- Applicant: Bernard Lasko
- Main IPC: B05C17/005
- IPC: B05C17/005
Abstract:
Hot melt adhesive pellets are melted and pressure pumped in a controlled application pattern on the substrate at the application site. The high frequency power supply, induction heated melting susceptor, pressure pump, and pattern control electronics are all contained in a single unit within adhesive projection distance.
Public/Granted literature
- US20100270289A1 Hot Melt Application System Public/Granted day:2010-10-28
Information query
