Invention Grant
- Patent Title: Coating solution for forming high dielectric constant thin film and method for forming dielectric thin film using the same
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Application No.: US12437672Application Date: 2009-05-08
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Publication No.: US07887879B2Publication Date: 2011-02-15
- Inventor: Jun Hee Bae , Seung Hyun Kim , Yul Kyo Chung , Won Hoon Song , Sung Taek Lim , Hyun Ju Jin
- Applicant: Jun Hee Bae , Seung Hyun Kim , Yul Kyo Chung , Won Hoon Song , Sung Taek Lim , Hyun Ju Jin
- Applicant Address: KR Kyungki-do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Kyungki-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2005-0093143 20051004
- Main IPC: B05D3/12
- IPC: B05D3/12 ; B05D1/40 ; B05D5/12

Abstract:
Disclosed herein are a coating solution for the formation of a dielectric thin film and a method for the formation of a dielectric thin film using the coating solution. The coating solution comprises a titanium alkoxide, a β-diketone or its derivative, and a benzoic acid derivative having an electron donating group. The method comprises spin coating the coating solution on a substrate to form a thin film and drying the thin film at a low temperature to crystallize the thin film. The titanium-containing coating solution is highly stable. In addition, the coating solution enables formation of a thin film, regardless of the kind of substrates, and can be used to form dielectric thin films in an in-line mode in the production processes of PCBs.
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