Invention Grant
- Patent Title: Electroforming mold and method for manufacturing the same, and method for manufacturing electroformed component
- Patent Title (中): 电铸模具及其制造方法以及电铸部件的制造方法
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Application No.: US11326149Application Date: 2006-01-05
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Publication No.: US07887995B2Publication Date: 2011-02-15
- Inventor: Takashi Niwa , Susumu Ichihara , Koichiro Jujo , Hiroyuki Hoshina
- Applicant: Takashi Niwa , Susumu Ichihara , Koichiro Jujo , Hiroyuki Hoshina
- Applicant Address: JP
- Assignee: Seiko Instruments Inc.
- Current Assignee: Seiko Instruments Inc.
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2005-007052 20050114; JP2005-203983 20050713; JP2005-335328 20051121
- Main IPC: G03F7/00
- IPC: G03F7/00

Abstract:
An electroforming mold has a first negative type photosensitive material formed on an electroconductive substrate, and a first through-hole extends through the firs photosensitive material to expose the electroconductive substrate. An electroconductive layer formed on an upper face of the first photosensitive material surrounds the first through-hole. A second negative type photosensitive material formed on an upper face of the electroconductive layer has a second through-hole that overlies and exposes both the first through-hole and a peripheral part of the electroconductive layer that surrounds the first through-hole. Because the electroconductive substrate and the electroconductive layer are separated from one another, the first and second through-holes precipitate an electroformed object independently during use of the electroforming mold resulting in a uniform electroformed object.
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