An LED includes a circuit board (1), a light emitter (3) mounted on the circuit board (1), and a reflector (4) mounted on the circuit board (1), the light emitter (3) including an LED element mounted on the circuit board (1) and a light-transmitting resin (2) to seal the LED element. The reflector (4) is configured to surround the light emitter (3) and includes an opening (5) which passes through an upper surface and a lower surface is provided at a central position to allow insertion of the light emitter (3), and an inclined inner surface in the opening (6) configured to be upwardly broadened. A reflection film (7) is provided on the inclined inner surface (6) of the opening in the reflector. A outer peripheral edge is a non-reflection film constituted area (8) and, simultaneously, a terminal position identification mark (10) adjacent to the non-reflection film constituted area (8) are provided. The reflector (4) is cut along a dicing line on the non-reflection film constituted area (8) where the reflection film is not provided, thus preventing the reflection film (7) from being peeled off.