Invention Grant
US07888181B2 Method of forming a wafer level package with RDL interconnection over encapsulant between bump and semiconductor die
有权
在凸块和半导体管芯之间的密封剂上形成具有RDL互连的晶片级封装的方法
- Patent Title: Method of forming a wafer level package with RDL interconnection over encapsulant between bump and semiconductor die
- Patent Title (中): 在凸块和半导体管芯之间的密封剂上形成具有RDL互连的晶片级封装的方法
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Application No.: US12235000Application Date: 2008-09-22
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Publication No.: US07888181B2Publication Date: 2011-02-15
- Inventor: Zigmund R. Camacho , Lionel Chien Hui Tay , Henry D. Bathan , Jeffrey D. Punzalan
- Applicant: Zigmund R. Camacho , Lionel Chien Hui Tay , Henry D. Bathan , Jeffrey D. Punzalan
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC, Ltd.
- Current Assignee: STATS ChipPAC, Ltd.
- Current Assignee Address: SG Singapore
- Agency: Patent Law Group
- Agent Roberts D. Atkins
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L21/00
Abstract:
A semiconductor device is made by providing a metal substrate for supporting the semiconductor device. Solder bumps are connected to the substrate. In one embodiment, a conductive material is deposited over the substrate and is reflowed to form the solder bumps. A semiconductor die is mounted to the substrate using a die attach adhesive. The semiconductor die has a plurality of contact pads formed over a surface of the semiconductor die. An encapsulant material is deposited over the solder bumps and the semiconductor die. The encapsulant is etched to expose the contact pads of the semiconductor die. A first redistribution layer (RDL) is formed over the encapsulant to connect each contact pad of the semiconductor die to one of the solder bumps. The substrate is removed to expose the die attach adhesive and a bottom surface of the solder bumps.
Public/Granted literature
- US20100072618A1 Semiconductor Device and Method of Forming a Wafer Level Package with Bump Interconnection Public/Granted day:2010-03-25
Information query
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