Invention Grant
- Patent Title: Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof
- Patent Title (中): 具有嵌入式电路和柱的集成电路封装系统及其制造方法
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Application No.: US12473233Application Date: 2009-05-27
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Publication No.: US07888184B2Publication Date: 2011-02-15
- Inventor: Il Kwon Shim , Seng Guan Chow , Heap Hoe Kuan , Seung Uk Yoon , Jong-Woo Ha
- Applicant: Il Kwon Shim , Seng Guan Chow , Heap Hoe Kuan , Seung Uk Yoon , Jong-Woo Ha
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Tshimaru
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/10
Abstract:
A method of manufacture of an integrated circuit packaging system includes: providing a shaped platform with a conductive post; mounting the shaped platform with the conductive post over a temporary carrier; mounting an integrated circuit device over the temporary carrier; encapsulating the conductive post and the integrated circuit device; removing a portion of the shaped platform isolating the conductive post; and removing the temporary carrier.
Public/Granted literature
- US20090315170A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED CIRCUITRY AND POST, AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2009-12-24
Information query
IPC分类:
