Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12392450Application Date: 2009-02-25
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Publication No.: US07888212B2Publication Date: 2011-02-15
- Inventor: Tomomitsu Risaki , Yuichiro Kitajima
- Applicant: Tomomitsu Risaki , Yuichiro Kitajima
- Applicant Address: JP Chiba
- Assignee: Seiko Instruments Inc.
- Current Assignee: Seiko Instruments Inc.
- Current Assignee Address: JP Chiba
- Agency: Brinks Hofer Gilson & Lione
- Priority: JP2008-044393 20080226
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
In a well region, an irregular structure is formed in a gate width direction, and a gate electrode is formed in concave portions and on top surfaces of convex portions via an insulating film. Upper and lower source regions are formed on one side of the gate electrode in a gate length direction, and upper and lower drain regions are formed on the other side thereof. By thus forming the lower source and drain regions in the source and drain regions, current concentration occurring in an upper portion of a channel region, which is generated as the gate length becomes shorter, may be suppressed and a current may be allowed to flow uniformly in the entire channel region, and hence an effective gate width is made wider owing to the irregular structure formed in the well region. Accordingly, an on-resistance of a semiconductor device is reduced to enhance driving performance.
Public/Granted literature
- US20090212375A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2009-08-27
Information query
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