Invention Grant
US07888237B2 Method of cutting semiconductor wafer, semiconductor chip apparatus, and chamber to cut wafer
有权
切割半导体晶片，半导体芯片装置和切割晶片的腔室的方法
- Patent Title: Method of cutting semiconductor wafer, semiconductor chip apparatus, and chamber to cut wafer
- Patent Title (中): 切割半导体晶片，半导体芯片装置和切割晶片的腔室的方法
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Application No.: US12265165Application Date: 2008-11-05
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Publication No.: US07888237B2Publication Date: 2011-02-15
- Inventor: Dong-Han Kim , Kyoung-Sei Choi , Chul-woo Kim
- Applicant: Dong-Han Kim , Kyoung-Sei Choi , Chul-woo Kim
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd
- Current Assignee: Samsung Electronics Co., Ltd
- Current Assignee Address: KR Suwon-si
- Agency: Stanzione & Kim LLP
- Priority: KR10-2007-0112165 20071105
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of cutting a semiconductor wafer includes preparing a semiconductor wafer including a scribe region and a chip region, forming a groove in the scribe region, loading the semiconductor wafer with the groove formed therein in a chamber, and cutting the semiconductor wafer into a plurality of chips through increasing a pressure of the chamber by a first pressure change rate, and then reducing the pressure of the chamber by a second pressure change rate.
Public/Granted literature
- US20090117710A1 METHOD OF CUTTING SEMICONDUCTOR WAFER, SEMICONDUCTOR CHIP APPARATUS, AND CHAMBER TO CUT WAFER Public/Granted day:2009-05-07
Information query
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