Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the semiconductor device
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12569671Application Date: 2009-09-29
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Publication No.: US07888243B2Publication Date: 2011-02-15
- Inventor: Kouta Takahashi , Susumu Iwamoto
- Applicant: Kouta Takahashi , Susumu Iwamoto
- Applicant Address: JP
- Assignee: Fuji Electric Systems Co., Ltd.
- Current Assignee: Fuji Electric Systems Co., Ltd.
- Current Assignee Address: JP
- Agency: Rossi, Kimms & McDowell LLP
- Priority: JP2004-032739 20040209; JP2004-216225 20040723
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/36

Abstract:
An active region in a semiconductor device is made up of a parallel p-n layer including a first p-semiconductor layer and a first n-semiconductor with the widths and total amounts of impurities being equal to each other to provide a structure in which charges are balanced. A section parallel to stripes in the parallel p-n layer in an inactive region is made up of a second parallel p-n layer including a second p-semiconductor layer, with its width larger than that of the first p-semiconductor layer, and a second n-semiconductor layer with its width smaller than that of the first n-semiconductor layer. The total amount of impurities in the second p-semiconductor layer is made larger than that in the second n-semiconductor layer to provide a structure in which charges are made unbalanced.
Public/Granted literature
- US20100022075A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE Public/Granted day:2010-01-28
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