Invention Grant
- Patent Title: Method of forming polycrystalline semiconductor film
- Patent Title (中): 形成多晶半导体膜的方法
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Application No.: US12133635Application Date: 2008-06-05
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Publication No.: US07888247B2Publication Date: 2011-02-15
- Inventor: Daisuke Iga , Yukio Taniguchi
- Applicant: Daisuke Iga , Yukio Taniguchi
- Applicant Address: JP Yokohama-shi
- Assignee: Advanced LCD Technologies Development Center Co., Ltd.
- Current Assignee: Advanced LCD Technologies Development Center Co., Ltd.
- Current Assignee Address: JP Yokohama-shi
- Agency: Oblon, Spivak,McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-151158 20070607
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/36

Abstract:
A method of forming a polycrystalline semiconductor film, which includes irradiating an amorphous semiconductor film formed on an insulating substrate with light to convert the amorphous semiconductor into a polycrystalline semiconductor with laterally grown crystal grains, thus forming a polycrystalline semiconductor film, wherein crystal growth in the semiconductor is controlled such that first crystal grains laterally grow in the first direction along a X-axis from the first group of initial nuclei, the second crystal grains laterally grow in the second direction opposite to the first direction along the X-axis from the second group of initial nuclei arranged apart from the first group of initial nuclei along the X-axis, and the first crystal grains collide against the second crystal grains at different points in time along a Y-axis.
Public/Granted literature
- US20080305618A1 METHOD OF FORMING POLYCRYSTALLINE SEMICONDUCTOR FILM Public/Granted day:2008-12-11
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