Invention Grant
- Patent Title: Curable composition containing thiol compound
- Patent Title (中): 含硫醇化合物的固化组合物
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Application No.: US12162081Application Date: 2007-01-25
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Publication No.: US07888399B2Publication Date: 2011-02-15
- Inventor: Hideo Miyata , Katsuro Urakawa , Haruhiko Ikeda , Yotaro Hattori
- Applicant: Hideo Miyata , Katsuro Urakawa , Haruhiko Ikeda , Yotaro Hattori
- Applicant Address: JP Tokyo
- Assignee: Showa Denko K.K.
- Current Assignee: Showa Denko K.K.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2006-017788 20060126
- International Application: PCT/JP2007/051168 WO 20070125
- International Announcement: WO2007/086461 WO 20070802
- Main IPC: C08G18/67
- IPC: C08G18/67 ; C08G61/12 ; C08G18/32 ; C08G18/71
Abstract:
The present invention relates to a curable composition having high adhesiveness and transparency, comprising a thiol compound containing two or more groups represented by formula (1): wherein the symbols in the formula have the meanings as described in the specification; and an urethane compound containing an ethylenically unsaturated double bond represented by formula (2): wherein the symbols in the formula have the meanings as described in the specification.
Public/Granted literature
- US20090023831A1 Curable Composition Containing Thiol Compound Public/Granted day:2009-01-22
Information query
