Invention Grant
US07888599B2 Printed circuit board including embedded capacitor and method of fabricating same
有权
包括嵌入式电容器的印刷电路板及其制造方法
- Patent Title: Printed circuit board including embedded capacitor and method of fabricating same
- Patent Title (中): 包括嵌入式电容器的印刷电路板及其制造方法
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Application No.: US12203081Application Date: 2008-09-02
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Publication No.: US07888599B2Publication Date: 2011-02-15
- Inventor: Young Woo Kim , Byoung Youl Min , Chang Myung Ryu , Woo Lim Chae , Han Kim
- Applicant: Young Woo Kim , Byoung Youl Min , Chang Myung Ryu , Woo Lim Chae , Han Kim
- Applicant Address: KR Kyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Kyunggi-Do
- Agency: Fish & Richardson P.C.
- Priority: KR2004-116807 20041230
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
Disclosed is a PCB including an embedded capacitor and a method of fabricating the same. The long embedded capacitor is formed through an insulating layer, making a high capacitance and various capacitance designs possible.
Public/Granted literature
- US20080314863A1 PRINTED CIRCUIT BOARD INCLUDING EMBEDDED CAPACITOR AND METHOD OF FABRICATING SAME Public/Granted day:2008-12-25
Information query
