Invention Grant
US07888604B2 Connection method of a flexible printed circuit board with two printed circuit boards, and electric or electronic component with parts connected by the connection method
失效
具有两个印刷电路板的柔性印刷电路板的连接方法，以及通过连接方法连接部件的电气或电子部件
- Patent Title: Connection method of a flexible printed circuit board with two printed circuit boards, and electric or electronic component with parts connected by the connection method
- Patent Title (中): 具有两个印刷电路板的柔性印刷电路板的连接方法，以及通过连接方法连接部件的电气或电子部件
-
Application No.: US11910685Application Date: 2006-04-11
-
Publication No.: US07888604B2Publication Date: 2011-02-15
- Inventor: Kohichiro Kawate , Andrew C. Lottes , James G. Vana, Jr. , Barbara L. Birrell , Alexander W. Barr
- Applicant: Kohichiro Kawate , Andrew C. Lottes , James G. Vana, Jr. , Barbara L. Birrell , Alexander W. Barr
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Agent Melanie S. Gover; Bradford B. Wright
- International Application: PCT/US2006/013273 WO 20060411
- International Announcement: WO2006/110634 WO 20061019
- Main IPC: H05K1/00
- IPC: H05K1/00 ; B32B7/12
Abstract:
Provided is a method of connecting conductive traces on one substrate to conductive traces on another substrate using an adhesive containing conductive particles and the resulting article.
Public/Granted literature
Information query
