Invention Grant
- Patent Title: Systems and methods for automatically adjusting the operational parameters of a laser cutter in a package processing environment
- Patent Title (中): 用于在包装处理环境中自动调整激光切割机的操作参数的系统和方法
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Application No.: US11536853Application Date: 2006-09-29
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Publication No.: US07888621B2Publication Date: 2011-02-15
- Inventor: Timothy J Abrott
- Applicant: Timothy J Abrott
- Applicant Address: US TN Memphis
- Assignee: International Paper Co.
- Current Assignee: International Paper Co.
- Current Assignee Address: US TN Memphis
- Agent Matthew M. Eslami
- Main IPC: B23K26/36
- IPC: B23K26/36 ; B23K26/03

Abstract:
A system includes a cutting station having a laser cutter for cutting surface marks, score lines, holes, slots, flaps, panels, etc. into a selected substrate, an image capture device for capturing digital image data associated with the selected substrate, and a computing system for controlling the cutting process. The computing system 32 initiates a calibration test cycle that 1) cuts a test pattern into the selected substrate; and 2) analyzes the test pattern that was cut into the selected substrate. Based on the results of the analysis of the captured image, the system adjusts the operational parameters of the laser cutter during a subsequent packaging production run utilizing the same substrate type.
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