Invention Grant
- Patent Title: Light emitting package and light emitting package array
- Patent Title (中): 发光封装和发光封装阵列
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Application No.: US11798390Application Date: 2007-05-14
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Publication No.: US07888689B2Publication Date: 2011-02-15
- Inventor: Hyung-kun Kim , Yu-sik Kim
- Applicant: Hyung-kun Kim , Yu-sik Kim
- Applicant Address: KR Gyunggi-do
- Assignee: Samsung LED Co., Ltd.
- Current Assignee: Samsung LED Co., Ltd.
- Current Assignee Address: KR Gyunggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2006-0044640 20060518
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
Example embodiments may include a light emitting device package. The light emitting device package may include a light emitting device, a package body including a cavity having a bottom surface on which the light emitting device is mounted and a side surface for reflecting light emitted from the light emitting device, a first electrode protruding from the package body, and a second electrode coupled with the package body. The first and second electrodes may be designed to couple respectively with the second and first electrodes of another light emitting device package, thereby forming an array of light emitting device packages.
Public/Granted literature
- US20070267637A1 Light emitting package and light emitting package array Public/Granted day:2007-11-22
Information query
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