Invention Grant
- Patent Title: Semiconductor memory structures
- Patent Title (中): 半导体存储器结构
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Application No.: US11752736Application Date: 2007-05-23
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Publication No.: US07888719B2Publication Date: 2011-02-15
- Inventor: Shau-Lin Shue , Chao-An Jong
- Applicant: Shau-Lin Shue , Chao-An Jong
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: H01L29/94
- IPC: H01L29/94 ; H01L29/00

Abstract:
A semiconductor structure includes a first conductive layer coupled to a transistor. A first dielectric layer is over the first conductive layer. A second conductive layer is within the first dielectric layer, contacting a portion of a top surface of the first conductive layer. The second conductive layer includes a cap portion extending above a top surface of the first dielectric layer. A first dielectric spacer is between the first dielectric layer and the second conductive layer. A phase change material layer is above a top surface of the second conductive layer. A third conductive layer is over the phase change material layer. A second dielectric layer is over the first dielectric layer. A second dielectric spacer is on a sidewall of the cap portion, wherein a thermal conductivity of the second dielectric spacer is less than that of the first dielectric layer or that of the second dielectric layer.
Public/Granted literature
- US20080290467A1 SEMICONDUCTOR MEMORY STRUCTURES Public/Granted day:2008-11-27
Information query
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