Invention Grant
- Patent Title: Semiconductor device and gate structure having a composite dielectric layer and methods of manufacturing the same
- Patent Title (中): 具有复合介质层的半导体器件和栅极结构及其制造方法
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Application No.: US12457364Application Date: 2009-06-09
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Publication No.: US07888727B2Publication Date: 2011-02-15
- Inventor: Ki-Yeon Park , Kyoung-Ryul Yoon , Dae-Sik Choi , Han-Mei Choi , Seung-Hwan Lee
- Applicant: Ki-Yeon Park , Kyoung-Ryul Yoon , Dae-Sik Choi , Han-Mei Choi , Seung-Hwan Lee
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR2005-0018415 20050305
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/788 ; H01L29/792

Abstract:
A semiconductor device and/or gate structure having a composite dielectric layer and methods of manufacturing the same is provided. In the semiconductor device, gate structure, and methods provided, a first conductive layer may be formed on a substrate. A native oxide layer formed on the first conductive layer may be removed. A surface of the first conductive layer may be nitrided so that the surface may be altered into a nitride layer. A composite dielectric layer including the first and/or second dielectric layers may be formed on the nitride layer. A second conductive layer may be formed on the composite dielectric layer. The first dielectric layer may include a material having a higher dielectric constant. The second dielectric layer may be capable of suppressing crystallization of the first dielectric layer.
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