Invention Grant
US07888734B2 High-voltage MOS devices having gates extending into recesses of substrates
有权
具有延伸到衬底凹槽中的栅极的高压MOS器件
- Patent Title: High-voltage MOS devices having gates extending into recesses of substrates
- Patent Title (中): 具有延伸到衬底凹槽中的栅极的高压MOS器件
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Application No.: US12328277Application Date: 2008-12-04
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Publication No.: US07888734B2Publication Date: 2011-02-15
- Inventor: Chen-Liang Chu , Chun-Ting Liao , Tsung-Yi Huang , Fei-Yuh Chen
- Applicant: Chen-Liang Chu , Chun-Ting Liao , Tsung-Yi Huang , Fei-Yuh Chen
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
An integrated circuit structure includes a high-voltage well (HVW) region in a semiconductor substrate; a first double diffusion (DD) region in the HVW region; and a second DD region in the HVW region. The first DD region and the second DD region are spaced apart from each other by an intermediate portion of the HVW region. A recess extends from a top surface of the semiconductor substrate into the intermediate portion of the HVW region and the second DD region. A gate dielectric extends into the recess and covers a bottom of the recess. A gate electrode is over the gate dielectric. A first source/drain region is in the first DD region. A second source/drain region is in the second DD region.
Public/Granted literature
- US20100140687A1 High-Voltage MOS Devices Having Gates Extending into Recesses of Substrates Public/Granted day:2010-06-10
Information query
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