Invention Grant
US07888779B2 Method of fabrication InGaAIN film and light-emitting device on a silicon substrate
有权
在硅衬底上制造InGaFET膜和发光器件的方法
- Patent Title: Method of fabrication InGaAIN film and light-emitting device on a silicon substrate
- Patent Title (中): 在硅衬底上制造InGaFET膜和发光器件的方法
-
Application No.: US11910735Application Date: 2006-04-14
-
Publication No.: US07888779B2Publication Date: 2011-02-15
- Inventor: Fengyi Jiang , Wenqing Fang , Li Wang , Chunlan Mo , Hechu Liu , Maoxing Zhou
- Applicant: Fengyi Jiang , Wenqing Fang , Li Wang , Chunlan Mo , Hechu Liu , Maoxing Zhou
- Applicant Address: CN Nanchang
- Assignee: Lattice Power (Jiangxi) Corporation
- Current Assignee: Lattice Power (Jiangxi) Corporation
- Current Assignee Address: CN Nanchang
- Agency: Park, Vaughan, Fleming & Dowler LLP
- Agent Shun Yao
- Priority: CN200510025179 20050415
- International Application: PCT/CN2006/000681 WO 20060414
- International Announcement: WO2006/108359 WO 20061019
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/203

Abstract:
There is provided a method of fabricating InGaAlN film on a silicon substrate, which comprises the following steps of forming a pattern structured having grooves and mesas on the silicon substrate, and depositing InGaAlN film on the surface of substrate, wherein the depth of the grooves is more than 6 nm, and the InGaAlN film formed on the mesas of both sides of the grooves are disconnected in the horizontal direction. The method may grow high quality, no crack and large area of InGaAlN film by simply treating the substrate. At the same time, there is also provided a method of fabricating InGaAlN light-emitting device by using the silicon substrate.
Public/Granted literature
- US20090050927A1 METHOD OF FABRICATION InGaAlN FILM AND LIGHT-EMITTING DEVICE ON A SILICON SUBSTRATE Public/Granted day:2009-02-26
Information query
IPC分类: