Invention Grant
- Patent Title: Temperature control of micromachined transducers
- Patent Title (中): 微加工传感器的温度控制
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Application No.: US12570298Application Date: 2009-09-30
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Publication No.: US07888844B2Publication Date: 2011-02-15
- Inventor: David Martin , Donald Lee , John Choy , Joel Philliber , Osvaldo Buccafusca
- Applicant: David Martin , Donald Lee , John Choy , Joel Philliber , Osvaldo Buccafusca
- Applicant Address: SG Singapore
- Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: H01L41/08
- IPC: H01L41/08
Abstract:
A micromachined structure, comprises a substrate and a cavity in the substrate. The micromachined structure comprises a membrane layer disposed over the substrate and spanning the cavity.
Public/Granted literature
- US20100327702A1 TEMPERATURE CONTROL OF MICROMACHINED TRANSDUCERS Public/Granted day:2010-12-30
Information query
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