Invention Grant
- Patent Title: Temperature compensation circuit
- Patent Title (中): 温度补偿电路
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Application No.: US12323873Application Date: 2008-11-26
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Publication No.: US07888987B2Publication Date: 2011-02-15
- Inventor: Koji Horie
- Applicant: Koji Horie
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Turocy & Watson, LLP
- Priority: JP2007-306980 20071128
- Main IPC: G05F3/26
- IPC: G05F3/26 ; H03K17/14

Abstract:
A temperature compensation circuit according to an embodiment includes a bias circuit configured to output a bias current, the bias current having a current value increasing in proportion to absolute temperature, in a low temperature region in which a temperature is lower than a predetermined temperature, and having another current value increasing at a faster rate than the current value increasing in proportion to absolute temperature, in a high temperature region in which the temperature is equal to or greater than the predetermined temperature, and a transistor having a collector connected to a power supply terminal, an emitter which is grounded, and a base supplied with the bias current.
Public/Granted literature
- US20090140792A1 TEMPERATURE COMPENSATION CIRCUIT Public/Granted day:2009-06-04
Information query
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