Invention Grant
- Patent Title: Helical coil design and process for direct fabrication from a conductive layer
- Patent Title (中): 螺旋线圈设计和从导电层直接制造的工艺
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Application No.: US12388306Application Date: 2009-02-18
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Publication No.: US07889042B2Publication Date: 2011-02-15
- Inventor: Rainer Meinke
- Applicant: Rainer Meinke
- Applicant Address: US FL Palm Bay
- Assignee: Advanced Magnet Lab, Inc.
- Current Assignee: Advanced Magnet Lab, Inc.
- Current Assignee Address: US FL Palm Bay
- Agency: Beusse, Wolter, Sanks, Mora & Maire, P.A.
- Agent Ferdinand M. Romano
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28

Abstract:
A conductor assembly of the type which, when conducting current, generates a magnetic field or in which, in the presence of a changing magnetic field, a voltage is induced. According to an exemplary embodiment a conductor is positioned along a path of variable direction relative to a reference axis. The conductor has a width measurable along an outer surface thereof and along a series of different planes transverse to the path direction. The measured conductor width varies among the different planes. In one example, the conductor path is helical, positioned about the axis between turns of helical spaces, and the conductor width varies as a function of the azimuth angle.
Public/Granted literature
- US20090206974A1 Helical Coil Design and Process For Direct Fabrication From A Conductive Layer Public/Granted day:2009-08-20
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